PUBLICATION
The accepted abstracts will be published on the conference website. Conference full paper will be published in the conference partners journals. All submitted papers will go through the standard review process of the journal. The conference full paper submission is optional.
Conference Partners Journals
You can submit your full conference presenting paper in any of the below journal during 15 – 30 September 2024.
1) Nanomaterials
(Publisher: MDPI International Publisher)
Nanomaterials (IF 5.3) is an international peer-reviewed open access journal published semimonthly online by MDPI. There will be an opportunity to publish peer-reviewed and accepted papers in Nanomaterials (https://www.mdpi.com/journal/nanomaterials). MDPI offers a 20% discount on the publication fees for conference attendees.
2) Electronics
(Publisher: MDPI International Publisher)
Electronics is a multidisciplinary journal designed to appeal to a diverse audience of research scientists, practitioners, and developers in academia and industry. The journal is devoted to fast publication of latest technological breakthroughs, cutting-edge developments, and timely reviews of current and emerging technologies related to the broad field of electronics. Experimental and theoretical results are published as regular peer-reviewed articles or as articles within Special Issues guest-edited by leading experts in selected topics of interest.
3) International Journal of Chemical Engineering and Materials
(Publisher: WSEAS International Publisher)
4) International Journal of Applied Sciences & Development
(Publisher: WSEAS International Publisher)
The full conference presenting paper will be promoted for publication in journals of an international publisher (WSEAS). The research papers with contents meeting the scope of the journal will be considered for publication after peer review. WSEAS participates in these Indexes CLICK HERE
5) International Journal of Structural Engineering, ESCI, IF=1.3
(Published by Inderscience Publisher) and indexed in Scopus (Elsevier); Web of Science: Emerging Sources Citation Index (Clarivate Analytics) and more
6) Journal of Intelligent Construction
(Published by the Tsinghua University Press)